| 摘要 |
PROBLEM TO BE SOLVED: To provide a chuck table mechanism of a grinding device, which securely releases a wafer from a holding surface of a chuck table when the wafer is released from being suctionally held without adding an atmosphere release path to a suction path for applying negative pressure to the chuck table. SOLUTION: In the chuck table mechanism, when a workpiece suctionally held on the chuck table 60 is released from being suctionally held, a control means 66 for controlling an electromagnetic on-off valve 633, an electromagnetic flow rate control valve 645, and a proportional control valve 647 closes the electromagnetic on-off valve 633 and opens the electromagnetic flow rate control valve 645, and controls a voltage applied to the proportional control valve 647 so that the flow rate of the proportional control valve 647 gradually increases. COPYRIGHT: (C)2009,JPO&INPIT
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