发明名称 Semiconductor device and method of producing the same
摘要 A semiconductor device includes a silicon carbide substrate having a channel region formed on a surface thereof; a silicon layer formed on the channel region; a gate insulation film formed on the silicon layer; and a gate electrode formed on the gate insulation film. A method of producing a semiconductor device includes the steps of: forming a silicon layer on a surface of a silicon carbide substrate; forming a gate insulation film on the silicon layer to form a laminated structure of the silicon layer and the gate insulation film; and forming a gate electrode on the gate insulation film.
申请公布号 US2009090919(A1) 申请公布日期 2009.04.09
申请号 US20080230774 申请日期 2008.09.04
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 UCHIDA HIDETSUGU
分类号 H01L21/28;H01L29/24 主分类号 H01L21/28
代理机构 代理人
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