发明名称 |
Semiconductor device and method of producing the same |
摘要 |
A semiconductor device includes a silicon carbide substrate having a channel region formed on a surface thereof; a silicon layer formed on the channel region; a gate insulation film formed on the silicon layer; and a gate electrode formed on the gate insulation film. A method of producing a semiconductor device includes the steps of: forming a silicon layer on a surface of a silicon carbide substrate; forming a gate insulation film on the silicon layer to form a laminated structure of the silicon layer and the gate insulation film; and forming a gate electrode on the gate insulation film.
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申请公布号 |
US2009090919(A1) |
申请公布日期 |
2009.04.09 |
申请号 |
US20080230774 |
申请日期 |
2008.09.04 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
UCHIDA HIDETSUGU |
分类号 |
H01L21/28;H01L29/24 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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