MODULE, WIRING BOARD AND MODULE MANUFACTURING METHOD

摘要

A module is provided with a wiring board wherein a conductor pattern is formed on an insulating layer, and a functional element mounted with its face down on the conductor pattern through an electrode. An opening section is formed in a region, which is in the functional element mounting position of the wiring board, is smaller than the projection surface of the functional element and is inside the portion where the electrode is bonded. A space between the functional element and the wiring board, and the opening section are sealed by a sealing resin.