AN INTEGRATED CIRCUIT DEVICE HAVING BARRIER AND METHOD OF FABRICATING THE SAME
摘要
An integrated circuit device includes a semiconductor die, the semiconductor die including a semiconductor substrate, driving/control circuitry disposed along a peripheral region of the semiconductor die, a MEMS device disposed within a central region of the semiconductor die, and a barrier disposed between the driving/control circuitry and the MEMS device.
申请公布号
WO2007145790(A3)
申请公布日期
2009.04.09
申请号
WO2007US12357
申请日期
2007.05.24
申请人
AKUSTICA, INC.;DIAMOND, BRETT, M.;ZELEZNIK, MATTHEW, A.