A METHOD FOR THE PRODUCTION OF A MICROELECTRONIC SENSOR DEVICE

摘要

The invention relates to a microelectronic sensor device and to a method for the production of such a device comprising the following steps: placing an IC chip (10) in an insertion hole (21) of an interconnect carrier (20), wherein a sensitive side (12) of the chip contacts a removable layer (30) that is attached to the bottom side (22) of the carrier (20); filling the insertion hole (21) with an underfill material (40) and removing the removable layer (30); electrically connecting (via wire bonding or any other method) bond-pads (11) on the chip (10); placing a structured element (50) with fluidic channels (51) on ridges (52) that are disposed on the bottom side of the interconnect carrier (20) and/or the chip (10); encapsulating the bondwires (14) in an insulating material (60).