| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board that does not require correction of warpage even in manufacturing the wiring board by preventing occurrence of warpage of the wiring board. <P>SOLUTION: This multilayer wiring board 100, 100a-100e including a wiring layer 40, 40a-40e with a power plane and/or ground plane 10, 10a-10ce formed therein, is characterized in that the power plane and/or the ground plane are/is cut at predetermined cut lines 20, 20a-20e to be divided into a plurality of power plane pieces and/or ground plane pieces 11, 11a-11e. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
