发明名称 BGA package having half-etched bonding pad and cut plating line and method of fabricating same
摘要 A ball grid array (BGA) package having a half-etched bonding pad and a cut plating line and a method of fabricating the same. In the BGA package, the plating line is cut to form a predetermined uneven bonding pad using half-etching, thereby increasing the contact area between the bonding pad and a solder ball. The BGA package includes a first external layer having a first circuit pattern and a wire bonding pad pattern wherein a chip is connected to a wire bonding pad using wire bonding. A second external layer includes a second circuit pattern, a cut plating line pattern, and a half-etched uneven solder ball pad pattern. In the second external layer, another chip is mounted on a solder ball pad. An insulating layer having a through hole interposed between the first and second external layers and electrically connects the first and second external layers therethrough.
申请公布号 US2009093110(A1) 申请公布日期 2009.04.09
申请号 US20080315721 申请日期 2008.12.04
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE HYO SOO;PARK SUNG EUN
分类号 H01L23/488;H01L21/71 主分类号 H01L23/488
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