发明名称 |
FLIP CHIP INTERCONNECTION WITH DOUBLE POST |
摘要 |
A packaged microelectronic assembly includes a microelectronic element (104) having a front surface (122) and a plurality of first solid metal posts (110) extending away from the front surface (122). Each of the first posts (110) has a width in a direction of the front surface (122) and a height extending from the front surface (122), wherein the height (H2) is at least half of the width (Wl). There is also a substrate (102) having a top surface (101) and a plurality of second solid metal posts (108) extending from the top surface (102) and joined to the first solid metal posts (110). |
申请公布号 |
WO2009045371(A2) |
申请公布日期 |
2009.04.09 |
申请号 |
WO2008US11271 |
申请日期 |
2008.09.26 |
申请人 |
TESSERA, INC.;KWON, JINSU |
发明人 |
KWON, JINSU |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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