发明名称 |
ARRANGEMENT OF SEMICONDUCTOR CHIPS IN A MULTILAYER FLOOR COVERING |
摘要 |
The invention relates to an arrangement of chips (10) bonded with sensors (7) in a multilayer floor covering. In order further to improve an arrangement of the type under consideration herein, in a simpler way of technical production, the invention proposes that in a first upper layer (1) circuit paths (4) are formed, separated from each other in a plane, to provide power to a chip (10), that a second middle layer (2) is provided in which the chip (10) is located, and that a third lower layer (3) is provided which likewise is connected electrically to the chip (10), wherein sensors (7) are located in the surface gaps between the chips (10). |
申请公布号 |
WO2009007335(A3) |
申请公布日期 |
2009.04.09 |
申请号 |
WO2008EP58747 |
申请日期 |
2008.07.07 |
申请人 |
VORWERK & CO. INTERHOLDING GMBH;MEGGLE, MARTIN;WALLMEYER, MARIO |
发明人 |
MEGGLE, MARTIN;WALLMEYER, MARIO |
分类号 |
G08B13/10;G01L1/14;G08B13/26;H01H3/14 |
主分类号 |
G08B13/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|