| 摘要 |
The present invention relates to an electrode assembly useful for analyzing metal electroplating solutions. Such electrode assembly comprises a measuring electrode, preferably a rotating disc electrode or a microelectrode, and at least one of an in situ cleaning mechanism, a nucleation and metal growth optimization mechanism, and a voltage limiting mechanism. The present invention also relates to usage of such electrode assembly for in situ cleaning of the measuring electrode, nucleation and metal growth optimization, or voltage limitation. |
| 申请人 |
ADVANCED TECHNOLOGY MATERIALS, INC.;KING, MACKENZIE, E.;WANG, WEIHUA;HAN, JIANWEN;ROEDER, JEFFREY, F.;LURCOTT, STEVEN, M.;STAWASZ, MICHELE |
发明人 |
KING, MACKENZIE, E.;WANG, WEIHUA;HAN, JIANWEN;ROEDER, JEFFREY, F.;LURCOTT, STEVEN, M.;STAWASZ, MICHELE |
