发明名称 PLASMA TREATMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus which can eliminate frequency interference among high-frequency signals, as well as easily, accurately, quickly establish impedance matching to each of high-frequency signals among each of electrodes corresponding to high-frequency power supplies for ICP electrode and FS electrode, and can also easily obtain stable ignition of plasma and surely excite plasma discharging. <P>SOLUTION: As the preset condition for automatic matching processing, a variable capacitor CFL1 for loading an FS matching circuit FM1 is fixed at a specified capacity to set a plurality of matching points to one point. Thus, the ratio of an input power ratio to an output power ratio is controlled at 1:1 for an ICP electrode ID1 and an FS electrode FD1. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009076797(A) 申请公布日期 2009.04.09
申请号 JP20070246390 申请日期 2007.09.25
申请人 PANASONIC CORP 发明人 OKITA SHOGO;WADA TOSHIHIRO;WATANABE AKIZO
分类号 H01L21/3065;H05H1/46 主分类号 H01L21/3065
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