发明名称 SURFACE-MOUNTING PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a surface-mounting package preventing damage in a bonding portion between a lead terminal and an insulator by structurally increasing a drag force against a moment, improving a fixing strength between the lead terminal and the insulator and correctly positioning the lead terminal. SOLUTION: The package has a structure in which a bottom wall opening 12b on a shell bottom wall 10b of a shell 10 and a side wall opening 12a on a shell side wall 10a are formed continuously, the insulator 14 is embedded between the other portions 15b, 16b of the lead terminal 15, 16 and a bottom wall opening edge/a side wall opening edge of the shell 10 in a bottom wall opening 12b and a side wall opening 12a of the shell 10 so that the side portions 15b, 16b of the lead terminals 15, 16 can be fixed on the bottom wall opening 12b and the side wall opening 12a of the shell 10. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009076702(A) 申请公布日期 2009.04.09
申请号 JP20070244580 申请日期 2007.09.21
申请人 PANASONIC CORP 发明人 SAKAMOTO SUKEYUKI
分类号 H01L23/04 主分类号 H01L23/04
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