发明名称 CONDUCTIVE PATTERN FORMATION INK, CONDUCTIVE PATTERN AND WIRING SUBSTRATE
摘要 A conductive pattern formation ink which can be stably ejected from a liquid droplet ejection head, a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern on a base member using a liquid droplet ejecting method and comprised of a dispersion solution. The dispersion solution includes a water-based dispersion medium, metal particles dispersed in the water-based dispersion medium, and a drying suppressant contained in the water-based dispersion medium, the drying suppressant being contained for preventing drying of the dispersion solution.
申请公布号 US2009090272(A1) 申请公布日期 2009.04.09
申请号 US20080241149 申请日期 2008.09.30
申请人 SEIKO EPSON CORPORATION 发明人 TOYODA NAOYUKI;KOBAYASHI TOSHIYUKI;ENDO SACHIKO
分类号 C09D11/02;B32B3/00 主分类号 C09D11/02
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