发明名称 Vibration resistance ensuring method for cup capacitor, involves assembling and soldering components using supporting balls for capacitor, whose body form protrudes in surface level of flat module over pad at rim of capacitor
摘要 <p>The method involves pressing electronic and/or electrical components i.e. cup capacitor, on a flat module by soldering paste. The electronic and/or electrical components are assembled and soldered using supporting balls and/or supporting elements (12) e.g. surface mounting device (SMD) units, for the electronic and/or electrical components, whose body form protrudes in a surface level of the flat module over an associated pad (9) e.g. copper pad, at a cup rim of the electronic and/or electrical components in an area of the body form of the components. An independent claim is also included for an arrangement for ensuring vibration resistance in electronic and/or electrical components.</p>
申请公布号 DE102007045630(A1) 申请公布日期 2009.04.09
申请号 DE20071045630 申请日期 2007.09.25
申请人 SIEMENS HOME AND OFFICE COMMUNICATION DEVICES GMBH & CO. KG 发明人 OCHMANN, ERNST
分类号 H05K1/18;H01G2/06;H05K3/30 主分类号 H05K1/18
代理机构 代理人
主权项
地址