发明名称 LIGHT EMITTING MODULE AND LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting module and a light emitting device such that an adhesion layer can be formed in a shorter time, mounting of a light emitting element inclined to a substrate surface can be suppressed, and extraction efficiency of light from the light emitting element is less affected to secure mounting strength of the light emitting element. <P>SOLUTION: The present invention relates to the light emitting module which has a substrate 2, the adhesion layer 6 applied uniformly over a surface of the substrate 2, and a plurality of light emitting elements 5 each having a light emitting layer 5b on one surface of an element substrate 5a and mounted on the surface of the substrate 2 via the adhesion layer 6, the height of the adhesion layer 6 after light emitting element 5 is mounted being less than that of the light emitting layer 5b of the light emitting element. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009076803(A) 申请公布日期 2009.04.09
申请号 JP20070246522 申请日期 2007.09.25
申请人 TOSHIBA LIGHTING & TECHNOLOGY CORP 发明人 OTANI KIYOSHI;IZUMI MASAHIRO;HONDA YUTAKA;SANPEI TOMOHIRO;HAYASHIDA YUMIKO
分类号 H01L33/62;H01L33/32;H01L33/42;H01L33/56;H01L33/60 主分类号 H01L33/62
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