| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition for electronic equipment excellent in long-term high-temperature durability and to provide an adhesive sheet for electronic equipment using the composition. SOLUTION: The adhesive composition for electronic equipment is provided which contains (a) a thermoplastic resin, (b) a thermosetting resin (c) a curing agent, (d) a heterocyclic azole compound and (e) an organopolysiloxane having a tri-functional siloxane unit expressed by general formula (1), wherein R<SP>1</SP>represents a monovalent organic group containing at least one kind selected from a group consisting of a phenyl group, alkyl group, oxetanyl group, vinyl group, hydroxy group and alkoxy group. The adhesive sheet for electronic equipment, electronic components and electronic equipment using the above composition are also provided. COPYRIGHT: (C)2009,JPO&INPIT |
