OPEN AIR SUCTION/EXHAUST EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide semiconductor manufacturing equipment capable of reducing a heat load in a clean room (1) and reducing energy consumption. SOLUTION: The semiconductor manufacturing equipment (12) generating heat during use is placed in the clean room (1) while covered with a housing (11). The housing (11) is constituted so as to be capable of introducing being air in the clean room 1 therein. The air in the housing (11) is exhausted through exhaust path members (24 and 25) out of the clean room (1). The housing (11) is equipped with a heat insulating material (4) to prevent thermal emission into the air in the clean room from the housing (11). A space between the housing (11) and the semiconductor manufacturing equipment (12) is made as a sealed space, and an air inlet path member (71) for taking air outside the clean room (1) into the sealed space may be connected with the housing (11). COPYRIGHT: (C)2009,JPO&INPIT