| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a solid electrolytic capacitor for use in various electronic devices. SOLUTION: A chip type solid electrolytic capacitor includes: an external package 5 covering an element stack layering plate-like elements 1; a base electrode 6 connected to an anode electrode part 3 exposed on one end face of the exterior 5; an intermediate electrode 7 connected to the base electrode 6 and a cathode electrode part 4 exposed on another end face of the external package 5; and an external electrode 8 formed on the intermediate electrode 7, wherein the base electrode 6 is constituted of a zinc layer formed by high-speed particle collision techniques. Thus, since a dielectric oxide film layer formed on a surface of the anode electrode part 3 is destroyed and stuck to an anode body with a high strength, improvement in contact and reduction in connection resistance can be attained, thereby realizing low ESL and further, the solid electrolytic capacitor is reduced in size and cost by decreasing the number of components and the number of assembly steps. COPYRIGHT: (C)2009,JPO&INPIT
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