| 摘要 |
PROBLEM TO BE SOLVED: To prevent solder ball 10 joined to circuit parts 1 from flowing away to copper foil patterns 3 and to certainly connect the circuit parts 1 with the copper foil patterns 3 in the case of soldering reflow, in a board with built-in circuit parts containing the circuit parts 1. SOLUTION: A method of manufacturing the board with the built-in circuit parts includes the steps of: putting an etching resist 2 on the copper foil patterns 3 of a middle layer board 4; etching the etching resist 2 at a position in a predetermined distance far from a position of the solder ball of the circuit parts 1 to form an opening part; making front surfaces of the copper foil patterns 3 coarse by carrying out an etching or the like of the opening part; and forming irregularities 3a. COPYRIGHT: (C)2009,JPO&INPIT
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