Themosetting Composition for Optical Semiconductor, Die Bond Material for Optical Semiconductor Device, Underfill Material for Optical Semiconductor Device, Sealing Agent for Optical Semiconductor Device, and Optical Semiconductor Device

摘要

A thermosetting composition for an optical semiconductor containing a silicone resin having a cyclic ether-containing groups and a thermosetting agent capable of reacting with said cyclic ether-containing group, wherein the silicone resin has, as the principal components, a structural unit expressed by the following formula (1) and a structural unit expressed by the following formula (2). The content of the structural unit expressed by the formula (1) is 0.6 to 0.95 (on a molar basis) and the content of the structural unit expressed by the formula (2) is 0.05 to 0.4 (on a molar basis) when total number of the structural units contained is taken as 1, and the content of the cyclic ether-containing group is 5 to 40 mol %: [formula 1] <?in-line-formulae description="In-line Formulae" end="lead"?>(R1R2SiO2/2) (1)<?in-line-formulae description="In-line Formulae" end="tail"?> and [formula 2] <?in-line-formulae description="In-line Formulae" end="lead"?>(R3SiO3/2) (2)<?in-line-formulae description="In-line Formulae" end="tail"?> at least one of R1, R2 and R3 represents a cyclic ether-containing group, R1, R2 and R3 other than the cyclic ether-containing group represent hydrocarbon having 1 to 8 carbon atoms or fluoride thereof.