| 摘要 |
PROBLEM TO BE SOLVED: To easily and visually confirm a contact state between the terminal of a semiconductor device and the terminal of a substrate, in a mounting structure formed by mounting the semiconductor device on a substrate with the terminal of the semiconductor device elastically deformed. SOLUTION: This mounting structure 1 has a semiconductor device 2 mounted on a substrate 3 through an NCF 4. A plurality of terminals 21, 22 are provided on the surface S1 of the substrate 3. The semiconductor device 2 has a plurality of bumps 12 formed on a surface 11a, and inspection bumps 18 having elasticity. The bump 12 has a protrusion 14 having elasticity, and island-shaped conductive films 15 provided on the protrusion 14, a plurality of the conductive films 15 are individually brought into contact with a plurality of the terminals 21, 22, and an inspection pattern 30 including at least a set of parallel lines facing each other while sandwiching a part or all of the contact surface 24 where the inspection bump 18 is brought into contact with the substrate 3 is provided on the substrate 3 in a portion corresponding to the inspection bump 18. COPYRIGHT: (C)2009,JPO&INPIT |
