| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal thin film and a polyimide wiring board that have sufficient adhesive strength between them, and manufacturing methods thereof. SOLUTION: Disclosed are: a method of manufacturing the metal thin film on a polyimide resin surface including a modification process of forming a modified layer by processing the polyimide resin surface with a first alkali solution to open an imide ring, a metal ion adsorption process of processing the modified layer with a metal ion containing solution, a first acid solution processing process of processing the modified layer with an acid solution; and a reduction process of processing the modified layer with a reducing solution to reduce metal ions adsorbed in the modified layer, and depositing a metal thin film; and the metal thin film formed by the same method. Further, disclosed are a manufacturing method of a polyimide wiring board including a wiring formation process of forming a wiring pattern after the manufacturing method of the metal thin film is implemented, and the polyimide wiring board manufactured by the same method. COPYRIGHT: (C)2009,JPO&INPIT
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