| 摘要 |
PROBLEM TO BE SOLVED: To realize higher conductivity and higher heat radiating property between an electronic component and a circuit substrate in an electronic device with the electronic component and the circuit substrate electrically and mechanically connected with each other via a conductive adhesive containing a carbon nanotube. SOLUTION: A conductive filler 32 in the conductive adhesive 30 is constituted by a carbon nanotube 33 and a fusion-bonding part 34 provided on the carbon nanotube 33 to fusion-bond to an electrode 21 of the electronic component 20 to an electrode 11 of the circuit substrate 10 when curing the conductive adhesive 30. Here, the fusion-bonding part is composed of fine particles 34 of metals such as Fe, Co and Ni contained in the carbon nanotube 33. COPYRIGHT: (C)2009,JPO&INPIT
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