| 摘要 |
A wired circuit board has a metal supporting board (2), an insulating layer (3) formed on the metal supporting board, a conductive pattern (4) formed on the insulating layer and having a pair of wires (9a,9b) arranged in spaced-apart relation, and a semiconductive layer (5) formed on the insulating layer (3) and electrically connected to the metal supporting board (2) and the conductive pattern (4). The conductive pattern has a first region (14) in which a distance (D1) between the pair of wires is small and a second region (15) in which the distance (D2) between the pair of wires is larger than that in the first region. The semiconductive layer (5) is provided in the second region (15). |
