| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a forming method for a conductive post superior in the controllability of a position and a size, etc., a manufacturing method for a multilayer wiring board and a manufacturing method for electronic equipment. <P>SOLUTION: This method forms a conductive post 24 which is connected to a conductive layer 14 covered with an insulating layer 18 while penetrating the insulating layer 18, and includes: a process for arranging a liquid excluding material in a conductive post formation region on the conductive layer 14 to form a liquid excluding portion 16 so as to have a thickness of 100 nm or smaller; a process for arranging a second liquid substance L2 containing an insulating layer forming material on the conductive layer 14 on which the liquid excluding portion 16 is formed, and superimposing the insulating layer forming material to form the insulating layer 18 which has an opening 19 in a region overlaid with the conductive post formation region; a process for arranging metal micro particles 22A in the opening 19; and a process for heating the metal micro particles 22A at a temperature equal to or higher than a fusing temperature of the metal micro particles 22A and fusion-bonding the metal micro particles 22A one another to form the conductive post 24, and further fusion-bonding the metal micro particles 22A to the conductive layer 14 to connect the conductive post 24 and the conductive layer 14. <P>COPYRIGHT: (C)2009,JPO&INPIT |
