SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SAME

摘要

PROBLEM TO BE SOLVED: To provide a technology capable of reducing a thickness of a semiconductor chip such as an IC chip. SOLUTION: A semiconductor substrate provided with an integrated circuit is polished by CMP or the like, and the semiconductor substrate is made into a thin film by forming an embrittlement layer in the semiconductor substrate and separating a part of the semiconductor substrate. Thus, semiconductor chips such as IC chips which are thinner than ever are obtained. Moreover, wiring provided on such thinned IC chips and wiring provided on an interposer are electrically connected through a conductive film formed of conductive material or formed by plating process. COPYRIGHT: (C)2009,JPO&INPIT