| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching solution in which: not only a laminated metallic film of Cu and Mo, but also a laminated metallic film of Cu and Mo which is difficult to etch by conventional technique are etched; and an etching sectional shape; having a preferable taper angle, which cannot be obtained by conventional technique, can be obtained without side etching. SOLUTION: The etching solution contains, as essential components, (a) at least one selected from a group of phosphate whose solution is neutral or acid and carboxylate whose solution is neutral or acid, (b) hydrogen peroxide, and (c) water. Copper or copper alloy, and molybdenum or molybdenum alloy of a multilayer laminated metallic layer comprising one layer or a plurality of layers of copper or copper alloy and one layer or a plurality of layers of molybdenum or molybdenum alloy are etched at a time. COPYRIGHT: (C)2009,JPO&INPIT
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