| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem of insufficient supply of a plating liquid into a through-hole to lead to no formation of intended plating in that part due to difficulty of thorough removal of hydrogen bubbles generated in a through-hole and a non-penetrating through-hole in conventional plating by vibration or shaking in an electroless plating method of a printed circuit board having the non-penetrating through-hole. SOLUTION: In the plating method of the printed circuit board, when electroless plating is performed on the printed circuit board immersed in the plating liquid while vibrating the printed circuit board, bubbling is also applied from below the printed circuit board by varying the flow rate. COPYRIGHT: (C)2009,JPO&INPIT
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