| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate having a lead, a semiconductor package and a method of manufacturing the substrate having a lead, capable of improving junction strength of the lead while maintaining electric characteristics in a wide band. SOLUTION: The substrate having a lead has: a base substrate 11 on which a rear metallizing section 26 is formed; and the lead 30 that has a junction section 31 joined to the rear metallizing section 26 and an extension section 32 extended from the junction section 31 to separate from the rear metallizing section 26, has a step section 34 as a space formation section for forming a gap between the junction section 31 and the rear metallizing section 26, and is joined to the rear metallizing section 26 by silver solder 20 as a jointing material arranged in the gap. COPYRIGHT: (C)2009,JPO&INPIT
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