HGA suspension pad barrier for elimination of solder bridging defect

摘要

A method and apparatus for preventing solder bridging. The method includes providing a substrate layer upon which a solder pad is disposed. The method further includes providing a signal conductive layer within the substrate layer. The method also includes forming a solder pad upon the signal conductive layer. The solder pad has a base surface. The method additionally includes forming a barrier portion above the said base surface of the solder pad. The barrier portion is for controlling solder flow during a reflow process.