SCALABLE INTERCHANGEABLE MULTIBAND POWER PACKAGE MOUNTING APPARATUS

摘要

A miniature multiple die packaging assembly suitable for use in a radio is provided. The assembly includes a heatsink having contact with a chassis of the radio, a circuit board containing a plurality of active devices having leads to a perimeter of the circuit board, and a mating board having an opening. The mating board attaches along a top perimeter of the circuit board to pass the leads of the circuit board for extending a connection of the active devices to a radio board. The plurality of active devices are in contact and coplanar with the heatsink for providing efficient heat dissipation. The circuit board can interchangeably accept single package die or multiple package die having different sizes and layouts.