METHOD FOR CLEANING WAFER

摘要

A method for cleaning a wafer is provided to remove the foreign material from a surface of a substrate by transmitting an ultrasonic wave to a film made of the isopropyl alcohol. A spin head(102) is rotated by a drive unit(104) in order to clean the wafer(W). Back-nozzles(124,126) are arranged through the internal center of the spin head. A nozzle unit(110) includes a spray nozzle(112) and a sonic vibrator(114). The nozzle unit supplies the cleaning solution to the surface of the wafer. The drive unit(106) reciprocates in an upper part of the wafer. The nozzle unit separates the foreign material from the surface of the wafer by vibrating the cleaning solution supplied to the surface of the wafer with the ultrasonic wave. A controller is electrically connected to the nozzle unit and the drive unit. The controller controls the operation of a wafer cleaning device(100).