| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device improved in reliability by restraining influence of a crack occurring due to probe inspection without reducing the number of electrode pads arrangeable per unit area. <P>SOLUTION: A probe region 32 allowing probe contact and a non-probe region 31 are formed in an electrode pad 21. In two or more lines of the electrode pads 21 arranged in a zigzag form, extraction wires 52 connecting the different electrode pads 21 to an internal circuit are arranged immediately below the non-probe regions 31 without arranging them immediately below the probe regions 32. <P>COPYRIGHT: (C)2009,JPO&INPIT |
