| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermistor chip which has superior electric performance, small volume, and low material cost, and a manufacturing method thereof. SOLUTION: Disclosed is the thermistor chip including a substrate, a first electrode, a second electrode, a thermistor layer and a first buffer layer, the substrate having a first surface. The first electrode is disposed on the first surface, the first buffer layer covers at least a portion of the first electrode, and the thermistor layer covers at least the first buffer layer. The first buffer layer has a fusion point higher the sintering temperature of the thermistor layer and the fusion point of the first electrode, which is electrically connected by the first buffer layer and thermistor layer. The second electrode and the first electrode are disposed at an interval, and electrically connected to the thermistor layer. Further, disclosed is the manufacturing method of the thermistor chip. COPYRIGHT: (C)2009,JPO&INPIT
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