| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cleaning substrate capable of suppressing generations of corrosion on metallic wires and eliminating contaminants such as abrasive particles adhered on wafers and ground wiring materials, and to provide a method for manufacturing a semiconductor device using the same. SOLUTION: The method for cleaning a substrate includes a step of chemical mechanical polishing for a semiconductor substrate and a step of cleaning the substrate with a cleaning solution. The cleaning solution comprises water and a compound containing alkali metal, and has an electrical conductivity of 600 to 15,000 mS/m. COPYRIGHT: (C)2009,JPO&INPIT
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