| 摘要 |
PROBLEM TO BE SOLVED: To provide a paste for circuit boards which reduces installation spaces and installation operations, and has an excellent heat radiation property. SOLUTION: The paste for circuit boards includes copper powders and thermosetting resins and has heat conductivity of not less than 4 W/m×K. The volume resistivity of a cured matter is 1×10<SP>-3</SP>Ωcm or more, the amount of copper powders is no less than 60 wt.%, no more than 90 wt.% of the paste for circuit boards in 100 pts.wt., and thermosetting resins contain epoxy resins. COPYRIGHT: (C)2009,JPO&INPIT
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