发明名称 SURFACE-MOUNTING PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a surface-mounting package preventing damage in a bonding portion between a lead terminal and an insulator by structurally increasing a drag force against a moment, improving the fixing strength between the lead terminal and the insulator and correctly positioning the lead terminal. SOLUTION: The package has a structure in which the insulator 14 filled from a lower opening 12 of a shell 10 into the inside of a cavity portion 13 is embedded between lead terminals 15 and 16 and between the lead terminal 15, 16 and the shell 10, the lead terminals 15, 16 are formed into a plate, and the insulator 14 extending from the lower opening 12 of the shell 10 to the outside of the shell is embedded in other side portions 15c, 16c of the lead terminals 15, 16 and a lower opening edge 12a of the shell 10. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009076701(A) 申请公布日期 2009.04.09
申请号 JP20070244579 申请日期 2007.09.21
申请人 PANASONIC CORP 发明人 SAKAMOTO SUKEYUKI
分类号 H01L23/04 主分类号 H01L23/04
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