发明名称 PLASMA PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an etching device capable of etching a plurality of boards collectively processed on an electrode plate while keeping the in-plane distribution thereof uniform. SOLUTION: An insulation member 22 extending longitudinally and laterally is arranged on a surface of a plate-like electrode body 21, and boards 7 are arranged so that each central part thereof is positioned on the electrode body 21 exposed among parts of the insulation member 22, and edge parts of the outer periphery thereof are positioned on the insulation member 22. Electromagnets 25 are previously embedded in parts of the electrode body 21 surrounded by the insulation member 22, and the lines of magnetic force of the magnets 25 are made to penetrate the center parts of the boards 7. When etching gas plasma is formed on the boards 7, and the respective boards 7 are subjected to an etching process, the difference between the etching speed in the outer peripheral part of each board 7 and that at the center part thereof is reduced. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009076816(A) 申请公布日期 2009.04.09
申请号 JP20070246671 申请日期 2007.09.25
申请人 ULVAC JAPAN LTD 发明人 TAKEI HIDEO;IKEDA SATOSHI;MIZUNO KENJI
分类号 H01L21/3065;C23C16/458;H01L21/205 主分类号 H01L21/3065
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