发明名称 SUBSTRATE FOR POWER MODULE
摘要 PROBLEM TO BE SOLVED: To provide a substrate for a power module which is suppressed in progress of cracking in a heat cycle and improved in durability. SOLUTION: A ceramic substrate 2 is made of a ceramic compound sintered body 20 having a matrix comprising AlN particles 2a and SiC particles dispersed in the matrix, and is characterized in that the AlN particles 2a form a plate shape and has an outward shape size of 5 to 30μm, the SiC particles comprise fibrous SiC particles 2b and spherical SiC particles 2c, the fibrous SiC particles 2b having a minor-axis size of 0.05 to 3μm and an aspect ratio of 3 to 20 and the spherical SiC particles 2c having a particle size of 1 to 500 nm, and the ratio of the SiC particles occupying the ceramic substrate is≤15% by volume. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009076648(A) 申请公布日期 2009.04.09
申请号 JP20070243868 申请日期 2007.09.20
申请人 MITSUBISHI MATERIALS CORP 发明人 AOKI SHINSUKE;NAGASE TOSHIYUKI
分类号 H01L23/13;H05K1/03 主分类号 H01L23/13
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