| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting device for an electronic component that can prevent an electronic component subjected to bonding from being heated unnecessarily. SOLUTION: The mounting device for an electronic component is used for bonding the electronic component A onto a heated base B and includes a heating member 6 which comes in contact with the lower surface of the base B where the electronic component A is to be bonded and which partially heats the base B and a cooling means 7 of cooling a periphery of the part of the base B heated by the heating member 6. COPYRIGHT: (C)2009,JPO&INPIT
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