发明名称 SOI SUBSTRATE CONTACT WITH EXTENDED SILICIDE AREA
摘要 A low resistance contact structure and method of making the structure. The structure includes a polysilicon contact through an upper silicon layer and buried oxide layer to a lower silicon layer of a silicon-on-insulation substrate. A region of the upper silicon layer surrounds the polysilicon contact and top surface of the polysilicon contact and surrounding region of upper silicon layer are metal silicided providing an extended contact area greater than the area of the top surface of polysilicon contact.
申请公布号 US2009090970(A1) 申请公布日期 2009.04.09
申请号 US20070868564 申请日期 2007.10.08
申请人 DANG DINH;DOAN THAI;LEVY JESSICA ANNE;LEVY MAX GERALD;NORRIS ALAN FREDERICK;SLINKMAN JAMES ALBERT 发明人 DANG DINH;DOAN THAI;LEVY JESSICA ANNE;LEVY MAX GERALD;NORRIS ALAN FREDERICK;SLINKMAN JAMES ALBERT
分类号 H01L29/78;H01L29/06 主分类号 H01L29/78
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