发明名称 |
CIRCUIT CONNECTING MATERIAL, CIRCUIT CONNECTION STRUCTURE, AND METHOD FOR PRODUCING THE SAME |
摘要 |
<p>Disclosed is a circuit connecting material for connecting a first circuit member obtained by forming a first circuit electrode on a major surface of a first substrate with a second circuit member obtained by forming a second circuit electrode on a major surface of a second substrate in such a manner that the first circuit electrode and the second circuit electrode face each other. This circuit connecting material contains an adhesive composition having a maximum light absorption wavelength within the range of 800-1200 nm.</p> |
申请公布号 |
WO2009044678(A1) |
申请公布日期 |
2009.04.09 |
申请号 |
WO2008JP67491 |
申请日期 |
2008.09.26 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD.;HIROSAWA, YUKIHISA;KUBOTA, YU |
发明人 |
HIROSAWA, YUKIHISA;KUBOTA, YU |
分类号 |
H05K1/14;C09J9/02;C09J11/06;C09J201/00;H01B1/22;H01R11/01;H05K3/36 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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