发明名称 CIRCUIT CONNECTING MATERIAL, CIRCUIT CONNECTION STRUCTURE, AND METHOD FOR PRODUCING THE SAME
摘要 <p>Disclosed is a circuit connecting material for connecting a first circuit member obtained by forming a first circuit electrode on a major surface of a first substrate with a second circuit member obtained by forming a second circuit electrode on a major surface of a second substrate in such a manner that the first circuit electrode and the second circuit electrode face each other. This circuit connecting material contains an adhesive composition having a maximum light absorption wavelength within the range of 800-1200 nm.</p>
申请公布号 WO2009044678(A1) 申请公布日期 2009.04.09
申请号 WO2008JP67491 申请日期 2008.09.26
申请人 HITACHI CHEMICAL COMPANY, LTD.;HIROSAWA, YUKIHISA;KUBOTA, YU 发明人 HIROSAWA, YUKIHISA;KUBOTA, YU
分类号 H05K1/14;C09J9/02;C09J11/06;C09J201/00;H01B1/22;H01R11/01;H05K3/36 主分类号 H05K1/14
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