An integrated thermal unit (10) comprising a bake plate (20) configured to heat a substrate supported on a surface of the bake plate; a chill plate (30) configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle (18) configured to transfer substrates from the bake plate to the cool plated, where in the substrate transfer shuttle has temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.
