Embodiments of a semiconductor die that includes proximity connectors proximate to a first surface of the semiconductor die are described. This semiconductor die is configured to communicate signals with another semiconductor die via proximity communication through one or more of the proximity connectors. Moreover, the semiconductor die includes a positive feature coupled to a second surface of the semiconductor die that facilitates mechanical alignment of the semiconductor die with the other semiconductor die. Note that a first region around the positive feature defines a first plane, and the positive feature protrudes above the first plane.
申请公布号
WO2009045711(A1)
申请公布日期
2009.04.09
申请号
WO2008US76555
申请日期
2008.09.16
申请人
SUN MICROSYSTEMS, INC.;KRISHNAMOORTHY, ASHOK V.;CUNNINGHAM, JOHN E.;MITCHELL, JAMES G.
发明人
KRISHNAMOORTHY, ASHOK V.;CUNNINGHAM, JOHN E.;MITCHELL, JAMES G.