| 摘要 |
A method for depositing material on a substrate (152, 252) is described. The method comprises maintaining a reduced-pressure environment around a substrate holder (150, 250) for holding a substrate (152, 252) having a surface, and holding the substrate (152, 252) securely within the reduced-pressure environment. Additionally, the method comprises providing to the reduced-pressure environment a gas cluster ion beam (GCIB) (128) from a pressurized gas mixture, accelerating the GCIB (128), and irradiating the accelerated GCIB (128) onto at least a portion of the surface of the substrate (152, 252) to form a thin film. In one embodiment, the pressurized gas mixture comprises a silicon-containing specie and at least one of a nitrogen-containing specie or a carbon-containing specie for forming a thin film containing silicon and at least one of nitrogen or carbon. In another embodiment, the gas mixture comprises a metal-containing specie for forming a thin metal-containing film. In yet another embodiment, the pressurized gas mixture comprises a fluorocarbon-containing specie for forming a thin fluorocarbon-containing film. |
