FILM FOR SEMICONDUCTOR WAFER PROCESSING

摘要

Disclosed is a film (10) for semiconductor wafer processing, which is a processing film of a multilayer structure comprising a generally circular adhesive film (11) to be cut into chip-sized pieces together with a semiconductor wafer (W) by being adhered to the semiconductor wafer (W) and expanded in the adhered state, and a generally circular adhesive tape (12) bonded to the other side of the adhesive film (11) which is the side opposite to the one adhered to the semiconductor wafer (W). The ratio of the diameter of the adhesive film (11) relative to that of the adhesive tape (12) is within the range of 0.815-1.