发明名称 3D ELECTRONIC MODULE
摘要 The module has a stack (100) of two slices (10, 30), where the slice (10) has a set of electrically conducting bumps on its face. The slice (30) comprises an electrically insulating material zone (61) passing through the thickness of the slice (30) and an electrically conducting element (3) passing through the slice (30) in the zone. The conducting element and the bumps are made of material having a determined hardness. The hardness of the material of the element (3) is lower than the hardness of the material of the bumps so that the bumps penetrate in the conducting element.
申请公布号 EP1955374(B1) 申请公布日期 2009.04.08
申请号 EP20060830256 申请日期 2006.11.30
申请人 3D PLUS 发明人 VAL, CHRISTIAN;LIGNIER, OLIVIER
分类号 H01L25/10;H01L25/065;H05K1/14 主分类号 H01L25/10
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