PROCESS FOR PRODUCING COPPER ALLOY SHEETS FOR ELECTRICAL/ELECTRONIC PART

摘要

A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width ² of the intensity of diffraction of {311} plane in the surface of a Cu-Fe-P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu-Fe-P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I (200)/I (220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220)plane, is 0.3 or less. In addition, a Cu-Fe-P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 µm or less.