发明名称 ISOLATION STRUCTURES FOR INTEGRATED CIRCUITS AND MODULAR METHODS OF FORMING THE SAME
摘要 Isolation structures for isolating semiconductor devices from a substrate include floor isolation regions buried within the substrate and one or more trenches extending from a surface of the substrate to the buried floor isolation region.
申请公布号 EP2044624(A1) 申请公布日期 2009.04.08
申请号 EP20070777316 申请日期 2007.05.30
申请人 ADVANCED ANALOGIC TECHNOLOGIES INC. 发明人 RYU, HYUNGSIK;CHAN, WAI, TIEN;DISNEY, DONALD, RAY;WILLIAMS, RICHARD, K.;CHEN, JUN-WEI
分类号 H01L21/761;H01L21/762;H01L21/8238 主分类号 H01L21/761
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