SOLID STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS

摘要

A solid state imaging device, a method for manufacturing the same, and an imaging apparatus are to record an image with high quality by reducing a dark current without changing the potential of a peripheral circuit unit. A plurality of sensor units(12) are formed in a semiconductor substrate and convert incident light into an electric signal. A peripheral circuit unit(14) is formed in the semiconductor substrate to be located in a side of the sensor unit. A layer(22) with a negative fixed electric charge is formed in the light input side of the sensor unit and forms a hole accumulating layer on a light receiving surface of the sensor unit.